The geometry furnished for these devices, as well as inward and 'J' - formed lead contact device families, may provide a wider process window for reflow solder processes as well.ĢIPC B: Median (Nominal) Land Protrusion – Products with a moderate level of component density may consider adapting the 'median' land pattern geometry. The median land patterns furnished for all device families will provide a robust solder attachment condition for reflow solder processes and should provide a condition suitable for wave or reflow soldering of leadless chip and leaded Gull Wing type devices.ģIPC C: Minimum (Least) Land Protrusion – High component density typical of portable and hand-held product applications may consider the 'minimum' land pattern geometry variation. Selection of the minimum land pattern geometry may not be suitable for all product use categories.

The use of classes of performance 1, 2, and 3 is combined with that of component density levels A, B, and C in explaining the condition of an electronic assembly.

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